Our Story

Mridul Sengupta

Co-Founder &  Technical Program Manager

Mridul has extensive experience in the VLSI industry, having held positions in leading companies such as:

• Invecas (Technical Lead)

• Synopsys (Senior Application Engineer)

• Texas Instruments (Application Engineer - Contractor through Interra)

• STMicroelectronics (Application Engineer - ACE of Synopsys)

• Xilinx (Application Engineer - ACE of Synopsys)

• Microsemi (Application Engineer - ACE of Synopsys)

• Interra Systems (Application Engineer)

Mridul Sengupta is a seasoned VLSI professional with over 16 years of expertise in semiconductor technology, spanning roles in product development, customer support, and technical leadership across global organizations. His career encompasses working with major EDA companies like Synopsys, Invecas, and Interra Systems, where he has made significant contributions to functional verification of analog IPs, Standard Cells, memory characterization, and reliability analysis for cutting-edge semiconductor technologies. Mridul has deep expertise in IP verification, mixed-signal co-simulation, SPICE parameter extraction, and TCAD simulation, with hands-on experience in advanced nodes including 28nm, 22nm, and FinFET devices. As a VLSI educator, he founded TechSimplifiedTV, a digital platform (YT channel & Blog) that delivers high-value technical content to the global semiconductor community. He is highly skilled in managing customer portfolios, handling escalations, and driving business growth through effective communication and technical solutions. With a robust technical skill set in scripting languages like PERL, TCL, and Python, and extensive experience in using EDA tools such as Synopsys CustomSim, HSPICE, Cadence Spectre, and Mentor Graphics Calibre, he has a unique ability to bridge the gap between Product R&D teams and end-users. Mridul holds a Master of Science in Electronic Science from the University of Calcutta and has authored multiple research papers on semiconductor device modeling and reliability analysis, presented at international conferences/Journals such as JSTS, SNUG and IWPSD,ELECTRO, CODEC. His commitment to knowledge sharing and technical excellence has earned him recognition, including the Interra Robin Award for his contributions to EDA infrastructure projects.

Munmun Dey

Co-Founder & Business Development Manager

Munmun brings a wealth of expertise from her career in top-tier VLSI companies, including:

• Intel (Module Lead- contractor through Synapse)

• Synapse-Design (Application Engineer)

• Synopsys (Corporate Application Engineer)

• Texas Instruments (Application Engineer - Contractor through Interra)

• Interra Systems (Application Engineer)

Munmun Dey is a highly skilled VLSI professional with over a decade of experience in semiconductor design, CAD flow development, and IP quality assurance. She has worked with leading technology companies like Synapse Techno Design Innovations, Synopsys, and Interra Systems, contributing significantly to the development and enhancement of CAD flows, memory compiler QC/QA, and automation processes. Munmun has expertise in advanced semiconductor technologies, including Intel 10nm, TSMC-45nm, and TI-28nm, and is proficient with EDA tools like Cadence Encounter, Silvaco Atlas, and ICV. Her core strengths lie in automating design verification workflows using scripting languages such as PERL, TCL, Shell, and Python to streamline the release of memory compilers and improve IP quality checks.

In her roles, Munmun has efficiently managed customer support for global clients, resolving post-sale issues and enhancing technical documentation to ensure seamless tool usage. She has also played a pivotal role in regression management, tool environment migration, and developing automation routines for release processes. Her contributions have led to the successful delivery of numerous tapeouts and the enhancement of in-house CAD tools used for IP verification. Munmun’s research experience includes modeling and simulation of advanced MOS devices, and strained silicon structures, with several publications in international conferences (IWPSD, ELECTRO,CODEC,ICCCD) and journals (JSTS).